Group Structure

              • ASM Pacific Technology
                  • Wire bonders
                  • Die bonders
                  • Encapsulation solutions
                  • Test handlers
                  • Clip bonders,
                  • CIS ?equipment
                  • TCB bonders
                  • Flip chip bonders
                  • Mold Under Fill (MUF)
                  • Panel molding
                  • Laser grooving and dicing
                  • Leadframes
                  • Advanced packaging materials (molded interconnect substrates)
                  • Assembly line solutions
                  • DEK printing systems
                  • SIPLACE placement systems
                  • ASM smart factory tools & services
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