Automotive Electronics

              ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

              AD8312 Plus Series

              Automatic Die Bonding System (12” wafer handling)

              Eagle AERO

              For High-end IC Applications

              Misc

              eClip Plus Series

              Automatic Clip Bonding System

              FIREBIRD TCB Series

              Automatic Thermal Compression Bonding System

              Ultrasonic Wedge Bonder

              HERCULES

              Heavy Aluminum Wire Bonding System

              Transfer Molding

              IDEALmold? 3G

              Automatic Encapsulation Solution (strip / reel form substrate handling)

              ISLinDA

              Automatic Die Bonding System (12” wafer handling)

              MP-TAB Series

              Automatic Trim & Form System

              NUCLEUS Series / NUCLEUS-XL Series

              Multi-Purpose Precision Pick & Place Tool

              20 Pickheads System

              SUNBIRD

              Fully Automatic Turret Sorting Handler

              AD832i

              Automatic Die Bonding System (8” wafer handling)

              Laser 1205

              UV Dicing System

              Other Applications

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