CIS

              ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

              AUTOPIA

              Automatic Active Alignment System (for Automotive Camera Application)

              COSMOS

              Automatic 3D Sensing Alignment System

              Eagle AERO

              For High-end IC Applications

              Lens Holder Attach System

              IS600GS

              Automatic Active Alignment Bonding System for Camera Module Assembly

              Lens Holder Attach System

              IS868LA3

              Automatic Lens Holder Attach System

              DI-water Cleaning System

              ISCM868S

              Automatic DI-Water Cleaning System

              ISLinDA

              Automatic Die Bonding System (12” wafer handling)

              Ball Bonder OPTO/LED Wire Bonding Equipment

              Harrier Xtreme

              Dual-Head Extreme High Speed Wire Bonder

              OPTO/LED Wire Bonding Equipment

              iHawk Xpress XL

              Wire Bonder

              Ball Bonder OPTO/LED Wire Bonding Equipment

              iHawk Xtreme

              Wire Bonder

              Strip Form Substrates AOI System

              VIM300 / IS-VIM300

              Automated Optical Inspection

              Other Applications

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