LEDs

              ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

              Aluminium Bonder Ultrasonic Wedge Bonder

              AB589 Series

              Rotary Head Fine Aluminum Wire Bonding System

              AD211 Plus II

              Automatic Direct Eutectic Die Attach System

              AD838L-G2

              Automatic Die Attach System

              Wafer Form

              AS410

              Automatic Chip Probing System

              Wafer to Tape & Reel

              AT420

              Automatic LED Taping System

              Eagle AERO

              For High-end IC Applications

              LS100-2

              Automatic Laser Scribing System

              Wafer Form

              MS60

              Automatic Map Sorting System

              AD100

              High Speed Epoxy Die Bonder (for Vertical LED Application)

              AD210 Plus

              Automatic Die Bonding System (6” wafer handling)

              AD830 Plus

              Automatic Epoxy Die Attach System (6” wafer handling)

              AD830P-Plus

              Automatic Die Bonder

              Other Applications

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