Mobile Communications

              Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

              AD8312 Plus Series

              Automatic Die Bonding System (12” wafer handling)

              AUTOPIA

              Automatic Active Alignment System (for Automotive Camera Application)

              COSMOS

              Automatic 3D Sensing Alignment System

              Eagle AERO

              For High-end IC Applications

              FIREBIRD TCB Series

              Automatic Thermal Compression Bonding System

              Ultrasonic Wedge Bonder

              HERCULES

              Heavy Aluminum Wire Bonding System

              Transfer Molding

              IDEALmold? 3G

              Automatic Encapsulation Solution (strip / reel form substrate handling)

              Lens Holder Attach System

              IS600GS

              Automatic Active Alignment Bonding System for Camera Module Assembly

              Lens Holder Attach System

              IS868LA3

              Automatic Lens Holder Attach System

              DI-water Cleaning System

              ISCM868S

              Automatic DI-Water Cleaning System

              ISLinDA

              Automatic Die Bonding System (12” wafer handling)

              MP-TAB Series

              Automatic Trim & Form System

              Other Applications

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